MRVL’s Modular Packaging Tech: Can it Transform AI Accelerators?
Marvell Technology MRVL uses advanced CMOS technologies at 5nm and 3nm nodes and is now shifting toward 2nm and below, which include innovations like gate-all-around transistors and backside power delivery. For advanced packaging solutions, Marvell Technology has been leveraging Chip-on-Wafer-on-Substrate and Integrated Fan-Out methods, which …